Intel has talked up its EMIB chip-packaging technology, which would be an alternative to TSM's (TSM) Chip-on-Wafer-on-Substrate (CoWoS) technology, which is used for advanced AI chips from Nvidia ...

By Derek Lichtfuss, Newmark Columbus, Ohio, is emerging as one of the nation’s most dynamic industrial markets. With a ...

FFO rose 46% to $149 million, with the surge attributed to U.S. bulk fiber network acquisition and over 200 megawatts of new ...

Roze AI plans to focus on AI and robotics, an area CEO Masayoshi Son sees as the ‘next frontier’ for SoftBank.

A developer withdrew plans for a massive data center in Indiantown, while the village clarifies an FPL rezoning request for ...