As artificial intelligence moves from model training into broader commercial deployment, the underlying data center architecture is changing rapidly. Higher computing density, faster interconnect ...
The company emphasizes comprehensive system design, multi-agent networks, and long-term infrastructure development to support ...
As AI processor design shifts to systems level, Alchip Technologies says its 3DIC platform is driving more efficient development of next-generation AI and high-performance computing devices through ...
A lot of companies think they have an AI problem. What they really have is a coherence problem across operating model, architecture, and capital allocation.
Liquid cooling is rewriting the rules of AI infrastructure, but most deployments have not fully crossed the line. GPUs and CPUs have moved to liquid cooling, while storage has depended on airflow, ...
In a recent Views & Comments column published in Engineering, researchers Jinghai Li and Li Guo from the Chinese Academy of Sciences offer profound insights into the future development of data science ...
New liquid-cooling enabled system delivers affordable, high-density SLT and burn-in test for high-demand, lower-volume HPC, AI, and automotive devices TOKYO, Sept. 18, 2025 (GLOBE NEWSWIRE) -- Leading ...
A heavily cited fact within the architecture industry is that the built environment accounts for 40% of global carbon emissions. The concerning statistic puts immense responsibility on construction ...
Payers are investing in automation, but many are still losing revenue after claims are processed Our approach is to ...
With the size of semiconductor transistors decreasing and chip complexity increasing exponentially, semiconductor test has become essential to ensuring that only high-quality products go to market.